Bioengineering: Books/E-books

Use the KU Libraries Catalog to find books (and more) including print and electronic resources.

Information on materials including ferrous and non-ferrous metals - topics include welding, corrosion, heat treating, microstructures, casting, machining, fatigue and fracture, medical devices, alloys and superalloys, and more.
Also available in print Spahr Engineering Library Reference TA459 .M43

Also available in print Spahr Engineering Library Reference QD65 .H3.

Hundreds of articles on the mathematical and modeling basis for approaching complex systems, together with hundreds more on the progress using these tools in the fields of physics, econometrics, ecosystems, climate change, weather prediction, nanoelectronics, complex networks, quantum computing, chemistry, astrophysics, geophysics, systems biology, physical biology, bioinformatics, medicine, system dynamics, engineering, control and dynamical systems, and robotics as well as social, economics and political sciences.

Contains extensive data on approximately 28,000 substances, including 2,400 new entries. Each entry includes a DPIM code, hazard rating, entry name, CAS number, DOT number, molecular formula, molecular weight, line structural formula, description of material and physical properties, and synonyms. The book also contains Immediately Dangerous to Life or Health (IDLH) levels for approximately 1,000 chemicals. It also covers exposure-level classifications for a number of regulatory agencies, from OSHA to the U.S. Department of Transportation.

Includes physical, thermophysical, thermodynamic, transport, safety, and environmental properties for over 5,000 inorganic substances and over 35,000 organic substances. Coverage also includes solutions, refrigerants, mixtures, building and insulation materials, superheated, saturated, and subcooled fluids, and pure metals and alloys, in addition to Wilson Parameters and activity coefficients for selected binary systems and adsorption capacity for purification of air and water.